Sonderforschungsbereich 1368 News
Adhesive bonding in an oxygen-free atmosphere

Adhesive bonding in an oxygen-free atmosphere

© Sandra Gerland/match
Glove box for providing the oxygen-free atmosphere.
© Sandra Gerland/match
Bonded aluminum specimens in tensile testing machine for strength testing

Adhesive bonding is a joining technology of the future. Bonding in an oxygen-free atmosphere offers completely new possibilities: Adhesive bonds of metals become more durable without an intervening oxide layer, and the curing of adhesives can be specifically influenced. Scientists of the Collaborative Research Centre are investigating such new bonding processes in an XHV-adequate atmosphere in subproject B04. Sandra Gerland describes the current status of the projects in the news portal phi. According to this, the greatest advantages are:

  • Product optimization by using oxide layer-free interfaces
  • Increased performance of bonded joints
  • Flexible handling of joining partners until selective curing is initiated

Read the complete article on the page of the news portal phi.

Further information on sub-project B04 - Adhesive-based assembly processes